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Saca todo el potencial de tu procesador AMD Ryzen de 3ª generación con la Asus Prime B550-Plus. Esta placa base ha sido equipada con un potente diseño de alimentación, soluciones de refrigeración completas y opciones de ajuste inteligentes que permitirán que el sistema trabaje como tú quieres. Un modelo que incorpora múltiples disipadores térmicos y una conectividad avanzada para que no eches nada en falta. Es importante reseñar también que la Asus Prime B550-Plus dispone de dos ranuras M.2 que soportan transferencias de datos de hasta 32 Gbps a través de PCIe 3.0.
Procesador
Chipset
Memoria
Slots
Gráficos
Almacenamiento
Conectores USB
Audio
Conectividad y redes
Conectores internos
Conectores traseros
Factor de forma
12+2 Phases IR Digital VRM Solution with PowIRstage
• 6-Layer 2X Copper PCIe 4.0 Mid-Loss Ready PCB
Intel® WiFi 6 802.11ax 2T2R & BT 5
HDMI 2.0
Advanced Thermal Design
• Fins-Array Heatsink
• Direct Touch Heatpipe
• 5 W/mK LAIRD Thermal Conductivity Pad
Intel® GbE LAN
• cFosSpeed Internet Accelerator
Integrated I/O Shield
• Q-Flash Plus USB Port
• Rear USB 3.2 Gen2 Type-C™
Dual PCIe 4.0 x4 M.2 Connectors
• PCIe 4.0/3.0 x4 NVMe support
• Dual Thermal Guards
Audio Solutions
• ALC1220-VB Audio
• High-End Audio Capacitors (WIMA & Nichicon Fine Gold)
Supports AMD Ryzen™ Series Processors
• Dual Channel DDR4, 4 DIMMs with Ultra Durable Memory Armor
Solid Pin Power Connectors
• 24 pin ATX Power Connector
• 8+4 pin CPU Power Connector
Front USB 3.2 Gen2 Type-C™
PCIe 4.0 x16/x8/x4/x1 Slots
• 2x Ultra Durable PCIe Armor
RGB FUSION 2.0
• Addressable LED Header*2
• RGB LED Header*3
GET READY FOR AMD RYZEN™ 3000-SERIES
GIGABYTE X570 motherboards based on the AMD X570 Chipset provide full support for 3rd Gen AMD Ryzen™ Processors. The all-new design is a testament to GIGABYTE's dedication to design quality. GIGABYTE X570 motherboards offer a rich list of features such as support for PCIe 4.0 and USB Type-C™ interfaces on select boards, refined audio, high speed of Ethernet and latest standard of WIFI design, to fulfill users' performance, audio, and data transfer needs. The new, advanced power and thermal design enables users to unleash the performance on AMD Ryzen™ 3000-series Processors, making the GIGABYTE X570 motherboards perfect for users looking to build the best AMD platform gaming system.
AMD StoreMI Technology
GIGABYTE X570 motherboards maximize your PC's potential with AMD StoreMI technology. StoreMI accelerates traditional storage devices to reduce boot times and enhance the overall user experience. This easy-to-use utility combines the speed of SSDs with the high capacity of HDDs into a single drive, enhances the read/write speeds of the device to match that of SSDs, bolsters data performance for incredible value, and transforms the everyday PC to a performance driven system.
The benefits of AMD StoreMI:
• Making the PC experience fast, smooth and easy
• Optimizing computer responsiveness from system boot to application launch
• Offering SSD performance with HDD capacity at an affordable cost
• Quickly accessing key files by automatically learning users' computing behaviors
Detail information please refer AMD official website: https://www.amd.com/en/technologies/store-mi
AORUS PERFORMANCE
Ultimate Power Design
To unleash the full potential of the 3rd Generation of AMD Ryzen™ CPU, the motherboard requires the best CPU power design. With the best quality components and GIGABYTE R&D design capability, the X570 AORUS is a true beast among motherboards.
12+2 Phases Digital Power
Power Architecture
2X Copper PCB
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